Silicon wafers preparation and properties, · Principle of silicon wafer surface grinding. A cup wheel with segmented diamond rim is pressed against corotating or counterrotating silicon wafer sitting on a flat vacuum chuck. Novel grinding systems, simultaneous double-sided grinding, have been introduced, and the results are promising, especially in machining large-size wafers  .Tschudin Centerless Grinding Machine, · The TSCHUDIN grinding machines handle a wide range of materials from steel and aluminium, glass, titanium, carbon, ceramic, germanium through to silicon and many more. Loading... Chat Replay is ...Why PE, · Silica ore is a rich mineral in the world and can be found in many industries. It can be processed into sand and powder with higher value and PE-600×900 Jaw crusher is commonly used as the first stage in processing sand and powder.
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